Area Array Packaging Processes: For BGA, Flip Chip, and CSP
New York, Chicago, San Francisco: The McGraw-Hill Companies, Inc., 2004. First Thus. Octavo; VG-; dark blue spine with white text; ex-library; first thus; cloth exterior has slight handling wear; ex-library sticker to spine; small sticker to rear; light wear to corners; strong binding; no jacket; text block exterior edges have light wear; few ex-library markings to endpapers; interior good otherwise; illustrated; pp 260. More